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Uni-Venture Technology Ltd

Showing 1 - 6 of 6, total 1 pages        [First] [Previous] [Next] [Last]

1
bga board
bga board
Specification: BGA Board
Detail: FR4 TG130 2 layers 96*60mm Solder mask:Green Silkscreen:White

2
std-technology rigid board
std-technology rigid board
Specification: 8 layer
Detail: Std-Technology Rigid Board sample Layer Count: 8L ENIG

3
10 layer board
10 layer board
Specification: 10 layer
Detail: 10 layer ENIG Impedance control Resin filled in hole Intensive IC

4
8 layer board
8 layer board
Specification: 8 layer
Detail: 8 layer ENIG black solder

5
rigid-flex board
rigid-flex board
Specification: 2 layer
Detail: 2 layer Rigid-flex pcb with impedance control

6
aluminum board
aluminum board
Specification: 1 layer
Detail: 1 layer,Aluminum Board,1.0 MM OSP, Mine line/width 6 mil
Showing 1 - 6 of 6, total 1 pages        [First] [Previous] [Next] [Last]
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